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Z-PACK HM-Zd connectors are one of the hottest
high-speed, differential, board to backplane electrical connectors to hit the telecommunications and
computer industries. It's an extension of the already established IEC 61076-4-101, Hard Metric connector
family, however HM-Zd provides a differential solution for applications in the range of 3-6.4
gigabit/second and has been demonstrated to support 12 gigabit/second.
Tyco Electronics' XAUI HM-Zd Interoperability Platform
is a common platform for interoperability testing supported by members of the 10 GEA XAUI
Interoperability Group and the 10 Gigabit Ethernet Consortium. HM-Zd has also been chosen as the
backplane interconnect for the PICMG 3.x (ATCA) industry standard, driven toward dramatically improving
and simplifying the routing of electronic interconnects.
Key Features
- Operation at speeds as high as 12 Gb/s has
been shown
- Standard Module size of 25mm
- Contact pitch 1.5mm within pair; 3.0mm pair
to pair within column
- Column to Column pitch 2.5mm
- Designed specifically for high speed
differential applications
- Available in three versions:
2 signal contact pairs per column (20 pairs per 25mm)
3 signal contact pairs per column (30 pairs per 25mm)
4 signal contact pairs per column (40 pairs per 25mm)
- Vertical press fit pin headers and right
angle press fit receptacles
2 pair and 3 pair (compatible with 5
row HM)
4 pair (compatible with 8 row HM)
- Card Pitch is less than 0.8 inch for 2 and 3 pair
headers and less than 1.0 inch for 4 pair headers

- Optimized footprint for improved electrical performance and ease of trace routing
Unobstructed routing channels on both daughtercard and backplane
Pin header and receptacle have the exact same footprint to simplify your PC board layout
- Designed to meet Telcordia requirements
Applications
- The Z-PACK HM-Zd connector system is suitable for use in high speed, backplane applications:
- Switches
- Servers/Blade Servers
- Routers
- Storage
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